发布时间：2017年1月20日
Apple W1 343S00131蓝牙模块
这W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130. They have a slight difference in the last digit in the package marks. TechInsights has confirmed that both 343S00131 and 343S00130 have the same die. This die measures 4.42 mm x 3.23 mm = 14.3 mm2. TechInsights has been tracking Internet of Things (IoT) SoCs for over a year and our observations indicate that this new W1 SoC is very competitively placed when comparing its die size and connectivity specification of Bluetooth 4.2 or greater. As far as the Bluetooth specification is concerned, Apple does not say if it the W1 is BT4.2 or BT5.
鉴于此模具的大小及其特色操作规范，我们将在此W1处理器上生成基本基准报告。该报告将标识流程节点和铸造厂;并包含楼层分析和模具利用表，以及测试和包装设备的成本估算。
