定期、简洁地分析高容量和新兴的成像和光学传感应用
For leaders who want to base their product road maps on hard facts and understand what’s really going on under the hood of state-of-the-art imaging devices, TechInsights' Image Sensor subscription is the ideal solution.
可用图像传感器竞争技术情报报告
TechInsights公司’ Image Sensor subscription product provides industry insight by monitoring technology as it enters mass production in high-volume imaging and optical sensing applications.

这种基于订阅的服务是在高容量和高增长应用中可靠和准确分析成像仪和光学传感器的权威和最具成本效益的来源,包括:
- 消费者成像(智能手机,平板电脑和数码相机)
- 三维传感和飞行时间(ToF)
- Automotive
- 安全/监视
- Industrial
- 专业设备,新兴应用程序
可用的图像传感器订阅
设备要素(DEF)
包括:
- 30 PDF reports (4-5 pages) and supporting images / year, and the analysis covers
- SEM bevel of the pixel array and SEM x-sections of the general pixel array and periphery structures
- Product/Module teardown images
- Design Win Tracking
- 值得注意的专利摘要–3次简报/年
- 趋势分析 - 3简报/年
- 年度报告
Device Essentials升级版(DEP)
需要订阅设备要素渠道
包括:
- Deeper analysis including SCM, TEM, TEM-EDS, and SIMS
- 分钟。10 PDF报告(〜100 +页面)和支持图像
图片r & Optical Sensor Packaging and Integration Analysis (PKG)
移动相机/光学传感器模块和独立成像/光学传感组件的结构概述
- Coverage of up to 60 targets per year
- 30-40 structural reviews including product teardown overview, module/package photographs/X-rays, module/package cross-sections, SEM-EDS of select features, concise analyst summary
- 季度简报,包括每年额外报道10-20个目标
- Annual trends webinar
图片Sensor sample analysis from TechInsights: 3D stacked, biometrics and more
3D堆叠、生物识别、相位检测自动对焦(PDAF)、机器视觉和安全都是当前图像传感器市场的不同创新领域。随着手机装进更多的摄像头,汽车增加了越来越多的图像传感器阵列,物联网设备带来了更多的图像传感器机会,市场参与者正在合作开发新方法,以应对对新技术日益增长的需求。
TechInsights公司图片Sensor subscription provides industry insight by monitoring technology as it enters mass production in high-volume imaging applications. Our example subscription content document provides a sampling of the types of analysis included, showcasing examples of innovations from Apple, Samsung, Sony, ON Semiconductor, SmartSens, Synaptics, and Goodix. It also includes a market overview, and a patent landscape of the top six companies in this space.
Our analysis is performed in-house in our world-class laboratories and interpreted and presented by industry-leading experts.
First to Report on Key Technology Trends
像素生成
组态
技术元素,新兴应用
2x1 OCLPDAF
Full F-DTI
部分B-DTI
光学堆栈
全局快门
Stacked ISPs
双PD
三层成像仪
像素共享
到F
屏蔽PDAF
TSV公司
DBI公司
锥体表面衍射结构
双PD
非拜耳CFA
搜索我们的分析和网站
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美国东部时间2020年6月24日星期三下午2:00主持:Chi Lim Tan 3D NAND(垂直NAND)凭借其更高的密度和更低的每比特成本,一直是固态硬盘(SSD)普及的驱动力,这得益于创新和持续发展
英特尔的10nm节点:过去,现在和未来 - 第2部分
有人说,在2017年下半年至2018年上半年的时间框架内,英特尔的10nm节点是如此半生不熟,以至于英特尔不得不为后续产品大幅重新设计其10nm工艺技术。在任何情况下,一个SKU和有限的可用性说明了问题。

再论APA光学GaN-HEMT的开创性专利
发布时间:2020年6月5日供稿人:辛金·迪克森·沃伦博士电力电子行业正处于转型期。多年来,硅基器件一直占据着行业的主导地位,传统的硅MOSFET晶体管被用于较低的成本
松下在专利货币化方面的专长从未如此重要
与许多其他企业一样,由于covid-19流感大流行,这家日本重量级企业正面临巨大的财务压力,但其利用其知识产权资产的长期记录可能证明是一种拯救
按需网络研讨会:GAN的电力设备生态系统与IP景观综述
5月27日星期三,2020 / 2:00下午ET主持:Sinjin Dixon-Warren电力电子行业在过渡时期。对于多年的硅基设备主导了该行业,具有传统的Si MOSFET晶体管用于
有效的NAND专利调查指南
由于波形和协议测试对于调查内存技术专利的使用证据至关重要,TechInsights的Martin Bijman和Neil MacLeod仔细研究了顶级NAND专利所有者的投资组合,以确定它们之间的区别
开启YMTC 64层3D Xtacking®NAND闪存的秘密
看看YMTC的第二代3D-NAND技术,它使用“Xtacking”将外围电路与内存阵列面对面而不是并排连接。最早发表在《半导体文摘》上。
SIC功率晶体管工艺流程分析: The Rohm SCT3022ALGC11 Process Flow
贡献作者:Sinjin Dixon-Warren碳化硅(SIC)电源晶体管的市场预计将在未来几年增长。SIC电源晶体管与传统的基于硅的设备有几个优点,包括
专利组合管理:2020年的有效战略和最佳实践
4月29日-中午12:00-1:30(美国东部时间)-现场网络研讨会,“专利组合管理:2020年的有效战略和最佳实践”,由知识集团主办。主要主题包括:专利组合管理的趋势和发展,以及

Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services
The Snapdragon 865 platform is Qualcomm's most advanced 5G chipset to date with support for 5G, sub-6, mmWave and LTE. 4G/5G dynamic spectrum sharing, will enable "operators to accelerate 5G deployments by using their existing 4G spectrum holdings to
看看苹果A12Z芯片上的仿生系统
苹果A12Z仿生SoC只是A12X的更名版,有启用的GPU内核吗?当我们第一次在实验室得到苹果ipadpro2020 A2068时,这是我们想知道的第一件事。什么是A12Z?当我们看到A12Z时,在视觉上看不到
TechInsights在Samsung Exynos 990中确认三星的真实7LPP进程
去年那Samsung announced the introduction of EUV into their 7LPP process used in the Exynos 9825. Through analysis of the part, we found little difference between their 7LPP process in the 9825 and their 8LPP process in the Exynos 9820. Now, we
YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips
Contributing Author: Jeongdong Choe Originally Posted March 12, Revised April 7 2020 TechInsights finally found 3D Xtacking® NAND devices manufactured from Yangtze Memory Technologies Co., Ltd. (YMTC) in Wuhan, China. With this device, YMTC has
三星Galaxy S20超5G摄像头Teardown
贡献作者:Ray Fontaine祝贺三星团队不仅提供了规格良好的相机系统,而且是第一个以0.7µm代像素上市的团队!2019年9月宣布的GH1叠层成像仪正在研发中
Samsung Galaxy S20 Ultra 5G Teardown Analysis
贡献作者:Daniel Yang,Ray Fontaine这是TechInsights'实验室中特别忙碌的时光。在我们开始拆除Xiaomi Mi 10旗舰系列的各种型号之后的几天 - 世界上第一个Qualcomm Snapdragon 865
Recent Analysis of Samsung’s Mobile RF Components
香农5800 55M5800A01随着行业对5G应用的扩展,三星在移动通信技术领域不断创新,包括射频收发器、mmWave相控阵解决方案以及5G嵌入式移动处理器
Xiaomi Mi 10 Teardown Analysis
我们在这里,等待Samsung Galaxy S20的发布,所以我们可以看到高通公司Snapdragon 865移动平台,并且沿着Xiaomi在2月13日宣布,MI 10 - 也基于Snapdragon 865 - 将是
If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
苹果公司(Apple Inc.)出人意料地警告称,由于冠状病毒(coronavirus)的流行,该公司可能无法实现本季度的销售目标,这对其芯片和其他供应商以及同样依赖中国生产产品的竞争对手来说,都是一个很大的痛点。
联发科最新移动射频组件及分析
MT6303P AN10516CW 2.95 x 1.74 - 180nm Mobile RF architecture is constantly increasing in complexity to support multiple standards, and we are discovering new mobile RF components in virtually every new phone release. At the time of this writing
In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
有多少层可以3d闪存堆栈?正如摩天大楼不能无限期地堆积一样,3D闪存的层数也有限。

PC技术趋势2020-DRAM和Flash
目前,有关各区的内地内地内地的各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各各12377る
Apple Is About to Add a Third OLED Supplier
这笔交易已酝酿多年。自2017年初以来,中国京东方科技集团(BOE)一直致力于为苹果提供iphone专用的OLED显示器。
华为Mate 30 Pro 5G拆解:卖6399元整机,BOM成本仅2799元
据机构分析,4G版是华为首款没有美国零部件的智能手机产品,而5G版仍使用一些美国制造的零部件,比例是。。。
深度拆除华为Mate30 Pro 5G:来自日本的2,000多种组成部分
从BOM表上看,整机预估价格为395.71元,折合人民币不到2800元,其中主控芯片约占整机价格的51.9%。
Imaging + Sensing End-of-Year Highlights
华为引领成像芯片领域军备竞赛,索尼凭借i-ToF大获全胜,事件驱动视觉传感器的出现发布:2019年12月18日供稿作者:雷·方丹,三星高级技术分析师,华为和苹果继续推进更多

Seoul Semiconductor patent auction analysis reveals a mixed bag of assets
Seoul Semiconductor recently dipped its toes into the sales side of the patent market with an announcement that it will be auctioning off two patent packages – one at the end of this month and the other in January.
Power Integrations Scores OEM Design Win with their PowiGaN Technology
发布时间:2019年12月12日投稿作者:Sinjin Dixon Warren博士,消费者对更小尺寸和更高功率的需求,加上政府的效率法规,正在推动USB适配器市场的创新。USB-C电源传输
东芝-WD联盟3D NAND大规模生产将使用三星TCAT工艺
集微网消息(文件/ yuna),据印象手表网站报告,东芝在12月8日召开的IEDM会议上调在3D NAND闪存量产中间使用类似于三星TCAT的存储单位结构。
Developing a successful licensing program
As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.
DRAM Scaling Challenges Grow
More nodes and alternative memories are in the works, but schedules remain murky.
桌面彗星湖将出现在2020年2月左右?英特尔CPU路线图
TechInsights于10月31日发布了一份题为“英特尔酷睿i7-1065G7”的摘要报告“冰湖10纳米第二代处理器分析”。
Kirin 990 5G核心数据曝光:113.31平方毫米集成103亿晶体管
Recently, Huawei released its new 5G mobile phone, the Mate 30 5G series. The performance of its Kirin 990 5G SoC is very exciting. Recently, professional chip research institute TechInsights dismantled this commercial 5G integrated SoC chip.
苹果U1 - 延迟芯片及其可能性
发布时间:2019年11月8日供稿作者:Stacy Wegner Figure 1:Apple U1 UWB芯片iPhone11中最吸引人的组件之一就是神秘的芯片Apple简单地贴上了“U1”的标签。TechInsights一直在忙着对此进行分析
华为Mate 30 Pro 5GTeardown
Introducing the Kirin 990 5G Posted: November 7, 2019 Contributing Authors: Daniel Yang, Stacy Wegner The Huawei Mate 30 Series is the latest installment of the company’s annual flagship smartphones, released on September 19, 2019 in Munich
分析NAND Flash和技巧研讨会:技术SSD Devices
日期:2019年11月6日/美国东部时间下午3:00至4:00由Neil MacLeod和Marty Bijman介绍内部探测、波形分析和更多数据中心的广泛采用和扩展将SSD市场推向了一个高度竞争和竞争的时期
英特尔核心I7-1065G7“冰湖”10 NM 2ND Gen处理器分析
英特尔已将其前10名NM 2ND Gen处理器发布为消费产品 - 英特尔酷睿i7-1065G7处理器,更好地称为冰湖。戴尔和微软已经宣布将冰湖列入其中一些最新产品。这个
The Evolution of SiC MOSFET Technology: A Retrospective
发布时间:2019年10月31日贡献作者:Sinjin Dixon-Warren碳化硅(SIC)是一种广泛使用的工业材料。Carborundum公司的WideScale生产于1893年在发现Acheson过程后,这是
Apple iPhone 11、11 Pro和11 Pro Max评论:性能、电池和摄像头提升
TechInsights公司has now officially released a die shot of the new Apple A13, and we can confirm a few assumptions on our side.
Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis
来自最近发布的Apple iPhone 11线的最有趣的组件之一是苹果已经谈到的一行;Apple U1超宽带(UWB)芯片。到目前为止,Apple只有说芯片允许定向
TechInsights公司: iPhone 11 Pro Max Cameras Cost $73.5
TechInsights公司publishes its estimation of Apple iPhone 11 Pro Max components. The cameras appear to be the post expensive part at $73.50.

电子政务 - 英特尔冰湖深度分析:六支柱的创新
At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lake processor.
SK Hynix 96L 3D PUC NAND分析
Among memory manufacturers worldwide SK hynix currently holds the 5th position in NAND Flash market share, with 10.3%. They are the latest to release a 9X-layer NAND solution, with the SK hynix 96L 3D PUC NAND. Development of SK hynix’ 96L 3D PUC
Inside the Apple 1720 Charger included with the iPhone 11 Pro Max
发布时间:2019年9月27日供稿作者:Sinjin Dixon Warren iPhone 11 Pro Max附带Apple 1720 18 W USB-C电源充电器。这个设备的额定输出电压为5伏和3安,或者9伏和2安TechInsights公司Analyses iPhone 11 Cameras
TechInsights发布了新的Apple iPhone 11 Pro Max Smartphone的拆除报告,其中包含一些信息:
苹果iphone11pro的拆卸对于STMicro和索尼来说是令人鼓舞的
STMicroelectronics and Sony似乎可以为Apple的最新旗舰iPhone提供四个筹码。许多其他历史的iPhone供应商也在最新的拆除时出现。
Apple iPhone 11 Pro Max Teardown
发布时间:2019年9月23日 - 更新:2019年10月1日贡献作者:Daniel Yang,Stacy Wegner,Albert Cowsky我们总是很高兴看到一个新的Apple iPhone,而今年的iPhone 11线也不例外。这是第一个苹果活动

网络研讨会:准备许可证:使用工具扩展许可证计划
最初提交时间:2019年9月19日/美国东部时间12:00至下午1:00主办人:Martin Bijman Licensing是一种行之有效的专利组合货币化手段,但那些将在从专利所有权到专利利润的道路上取得成功的人将不会
微米分析概述:LPDDR4 DDR4 3D NAND Flash和XPoint反向工程
发布日期:2019年9月17日,凭借2018年304亿美元的收入、NAND闪存16.5%的市场份额和DRAM 23%的市场份额,美光是存储和存储技术领域最大的参与者之一。对于那些希望支持其产品的人
How Graphical Solutions Improve 3D NAND Effective Device Density
在摩尔定律的推动下,存储器和逻辑芯片半导体制造商通过增加晶体管密度来降低产品成本和提高性能。
网络研讨会:电力半导体 - 市场概览和深度SIC和GAN设备分析
Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for more

移动制造:高端企业能赚多少钱?
High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.
Peloton IPO Preview: All Hype, No Muscle
Peloton,生产和销售溢价,大屏幕,固定式健身自行车和跑步机,以及旨在使用该设备的课程的课程订阅,预计将在未来几个月的某个时间公开。
UnMóvildeGamaAlta Se Vende Casi Al Triple de Lo Que Cuesta Fasticarlo
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las
高端手机销售近三倍的成本制造它
A mobile phone is sold almost three times more expensive than it costs to manufacture it, taking into account the cost of all the components that make up these devices, from the battery or camera to the operating system that allows applications to
Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.
为什么我在传感器中始终写入“漏出”
DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modules
Deca Technologies Fan-in VLP在Qualcomm PM8150
发布日期:2019年8月29日,WLP市场的粉丝预计将以稳定的速度增长;从2018年的29亿美元增长到2024年的44亿美元,复合年增长率为6.5%。最近的贡献者之一,这个市场是德卡技术,其M系列扇出晶圆级封装
GaN, SiC, and Si technologies in AC Adapters
Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device
华为Mate 20 X(5G)拆卸中意外设计获胜
2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung
Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
博客的三系列:smartp的艺术的状态hone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image
Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
分为4部分的博客系列:智能手机成像仪的最新技术第3部分:背光有源硅厚度,深沟隔离(DTI)发布时间:2019年7月23日贡献作者:Ray Fontaine内容改编自TechInsights的论文
Velodyne激光雷达圆盘拆卸
发布时间:2019年7月22日根据BIS研究,2017年汽车利达市场估计为3.53亿美元,预计将达到2028年的8.32亿美元。激光雷达市场已成为汽车最具竞争力的部分之一
第2部分:像素缩放和缩放启动器
分为4部分的博客系列:智能手机成像器的最新技术第2部分:像素缩放和缩放使能器发布日期:2019年7月16日贡献作者:Ray Fontaine内容改编自TechInsights为国际图像传感器研讨会撰写的论文
AC Adapters: GaN, SiC or Si?
TechInsights对三种关键产品的分析表明,使用SiC、GaN和Si超结器件可以制造出高效、高功率、紧凑的交流适配器。
第1部分:芯片堆叠和芯片到芯片互连
由4部分组成的博客系列:智能手机成像仪的现状第1部分:芯片堆叠和芯片到芯片互连Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image
Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
发布日期:2019年6月11日Ambiq Micro Apollo 3 Blue超低功耗MCU市场人满为患,竞争激烈,全球半导体公司在该技术领域的研发投入不断增加;预计2019年该市场将达到约200亿美元
三星、SK hynix和Micron的1y DDR4 DRAM
发布时间:2019年6月7日三星LPDDR4X 17 NM 1Y三星DDR4 17 NM 1Y Micron MT40A2G4SA-062E 8GB DDR4前3名DRAM制造商(三星,SK Hynix和Micron)于2017年和2018年达到了Sub-20 NM,引入了1X。一个新的里程碑是
How long can Sony keep the top spot in the image sensor market?
不久前,远大研究发布全球CIS(CMOS图像传感器)市场数据,指出其整体市场规模仍在快速增长。
Qualcomm QTM052 MMWAVE天线模块
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges
NAND技术:打开大门
TechInsights的Martin Bijman和Trevor Izzak解释说,在600亿美元的NAND技术市场上,专利前景分析可以给公司带来优势。
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
在其核心,主张运动依赖于使用证据(EoU),以证明存在正在进行的侵权行为。如果没有人使用你的专利组合所涵盖的技术,那么你的专利就没有那么有价值了。相反地,当存在出口创汇时,专利组合的价值更大。
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.
来自IEDM18的TechInsights内存技术更新
发布时间:2019年4月11日投稿作者:迪克·詹姆斯,赵正东去年周日晚上在IEDM,TechInsights举行了一个招待会,Arabinda Das和赵正东发表了演讲,吸引了一屋子与会者
9X层3D NAND分析
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L
三星Galaxy S10 5G拆卸
发布时间:2019年4月9日贡献作者:丹尼尔杨&斯塔奇Wegner它在这里。它在我们的实验室中......上周发生了两个主要的5G活动:Verizon在芝加哥推出了5G网络,并在全球的另一面,三星推出了世界
Analyzing innovations in mobile radio frequency front-end integration
发布时间:2019年4月9日3G和早期4G智能手机的移动射频前端架构相对简单,可以用分立组件构建。如今,移动射频(RF)前端的支持变得更加复杂
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
最初呈现时间:2019年4月9日/美国东部时间下午2:00至3:00主持:Michel Roy低密度扇出封装技术已经存在了十多年。由于RDL计数和行空间/行宽度功能的限制,这
3D NAND Metrologology挑战生长
(半导体工程)大挑战是表征3D NAND器件的内部部分,该内部包括复杂的材料,多层和微小沟道孔。然后,当您添加更多层时,计量挑战增加

西门子的专利申请不断攀升,但质量胜于数量才是游戏的名称
2018年,西门子(Siemens)超越华为(Huawei)成为欧洲专利局(EPO)的头号备案商,这是自2011年以来,西门子从未占据过的一个位置。它投资了。。。
Samsung Galaxy S10+ Teardown
发布时间:2019年3月1日投稿作者:Michelle Alarcon、Daniel Yang、Stacy Wegner、Albert Cowsky我们提前一点拿到了新的三星Galaxy S10+!TechInsights从韩国收到了Exynos三星Galaxy S10+SM-G975F/DS,并已投入使用
网络研讨会:移动射频领域
最初提交时间:2019年2月27日/3:00至4:00美国东部时间主持:John Sullivan A Patent and Technology Perspective我们估计移动射频(RF)市场价值约190亿美元。移动射频创新旨在提高
Lenovo Brings the New Snapdragon to Market
发布时间:2019年2月20日贡献作者:Stacy Wegner和Daniel Yangeel Yangovo Z5 Pro GT您将需要多长时间1到220,000可能超过32秒,据报道,32秒据据据说联想出售多久
Navitas发现在RavPower RP-PC104-W氮化镓45 W USB C电源充电器
发布时间:2019年2月7日投稿作者:Sinjin Dixon Warren,PhD Figure 1–RAVPower RP-PC104 USB-C充电器650 V氮化镓(GaN)功率高电子迁移率晶体管(HEMT)的主要新兴应用之一可能
特斯拉准备将麦克斯韦的干电极创新应用于电池制造
发布时间:2019年2月7日贡献作者:Marty Bijman和Jim Hines图1 - 特斯拉的投资组合,包括Maxwell和Solarcity收购图2 - Tesla Portfolio Landscapes,显示了哪些发明起源于特斯拉,孤主性,以及
网络研讨会:寻找技术使用的证据-好的,坏的,和丑陋的
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can
网络研讨会:利用技术证据加强专利
最初提出:2018年10月23日至2018 / 12:00至下午1:00托管:Mary Lupul专利加强是我们用来描述可以在起诉期间可以应用的不同方法来最大限度地提高雷竞技会黑钱吗专利的有用性
网络研讨会:优化专利起诉以实现更强大、更有价值的专利
最初呈现:2018年10月4日/晚上:下午1:00主办于:Martin Bijman&George Pappas专利加强是指在起诉期间从专利中实现最大潜力的过程 -雷竞技会黑钱吗
网络研讨会:比较领先的机顶盒、流媒体设备和智能电视——设计和BoM视角
最初呈现时间:2018年9月18日/美国东部时间下午2:00至3:00,主持人:Stacy Wegner,有一个重要的跳线切割趋势,关于运营商如何反应和修改他们的产品,以留住受流媒体诱惑的订户,人们已经说了很多
汽车专利:所有者、技术和调查
最初呈现:2018年7月11日至2:00至下午3:00 et主持:Jim Hines汽车行业正面临着新的市场进入者的破坏,新兴的流动性商业模式以及改变对汽车所有权的消费者态度。未来
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Intel 10 nm Logic Process Analysis (Cannon Lake)
发布时间:2018年6月12日英特尔10nm逻辑进程分析TechInsights发现了期待已久的Cannon Lake——联想IdeaPad330中使用的i3-8121U CPU内部的英特尔10nm逻辑进程。这项创新有以下特点:逻辑晶体管
SK hynix 72L 3D NAND Analysis
发布时间:2018年5月31日SK hynix 72L 3D NAND Analysis SK hynix声称已经创造了业界第一个72层256Gb 3D NAND闪存。与48层3D TLC芯片相比,这种创新的块大小大了50%,编程时间更短
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
最初呈现时间:2018年5月3日/美国东部时间下午3:15至4:00主持人:Martin Bijman“黑匣子揭秘”是我们用来指“硬东西”的术语——由于某种原因,难以分析使用证据的技术。这些可以
What does Uber’s patent landscape look like?
发布时间:2018年2月27日供稿作者:Marty Bijman最近,IAM的Timothy Au发布了一篇博客,介绍了Uber的投资组合。该博客引用了Uber的投资组合构成,并提供了过去5年中他们的IP事件的历史记录
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –
网络研讨会:释放软件专利的价值-技术视角
最初呈现:2018年2月1日/ 12:00 PM - 1:00 ethet ethered by:Mike Mclean,Gene Quinn&Walter Hanchuk Alice对软件专利产生了影响,但它们可以且仍然确实保持重大价值。如果您的投资组合包含软件
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职位空缺:软件开发人员
我们目前正在寻求一个完整的堆栈软件开发人员,加入我们的科罗拉多州TechInsights平台开发团队。您是否对解决复杂和有趣的问题有热情?你努力每天学习新的东西吗?你做